US 12,126,144 B2
Light emitting device including base and base cap
Tomokazu Taji, Anan (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on May 22, 2023, as Appl. No. 18/321,076.
Application 17/090,429 is a division of application No. 16/116,856, filed on Aug. 29, 2018, granted, now 10,862,276, issued on Dec. 8, 2020.
Application 18/321,076 is a continuation of application No. 17/090,429, filed on Nov. 5, 2020, granted, now 11,695,255.
Claims priority of application No. 2017-167144 (JP), filed on Aug. 31, 2017; and application No. 2018-156001 (JP), filed on Aug. 23, 2018.
Prior Publication US 2023/0291181 A1, Sep. 14, 2023
Int. Cl. H01S 5/40 (2006.01); G01R 31/26 (2020.01); G01R 31/44 (2020.01); H01S 5/00 (2006.01); H01S 5/02255 (2021.01); H01S 5/02257 (2021.01); H01S 5/0237 (2021.01); H01S 5/30 (2006.01); H01S 5/02208 (2021.01); H01S 5/02325 (2021.01); H01S 5/02345 (2021.01)
CPC H01S 5/4018 (2013.01) [G01R 31/2601 (2013.01); G01R 31/2635 (2013.01); G01R 31/44 (2013.01); H01S 5/0014 (2013.01); H01S 5/0087 (2021.01); H01S 5/02255 (2021.01); H01S 5/02257 (2021.01); H01S 5/0237 (2021.01); H01S 5/3013 (2013.01); H01S 5/005 (2013.01); H01S 5/0071 (2013.01); H01S 5/02208 (2013.01); H01S 5/02325 (2021.01); H01S 5/02345 (2021.01); H01S 5/4031 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A light emitting device comprising:
a base comprising a first wiring, a second wiring, and a third wiring;
a first semiconductor laser element electrically connected to the first wiring and the second wiring, at an upper surface side of the base; and
a second semiconductor laser element electrically connected to the second wiring and the third wiring, at the upper surface side of the base; wherein:
the base comprises a frame surrounding the first semiconductor laser element and the second semiconductor laser element in a top view;
the light emitting device further comprises a base cap fixed to the frame such that the first semiconductor laser element and the second semiconductor laser element are enclosed in a space defined by the base and the base cap;
the first semiconductor laser element and the second semiconductor laser element are connected in series;
a portion of the first wiring, a portion of the second wiring, and a portion of the third wiring are exposed at locations outside the space defined by the base and the base cap;
the first wiring comprises a first part that is located inside the space defined by the base and the base cap, and a second part that is exposed at a location outside the space defined by the base and the base cap;
the first wiring, the second wiring, the first semiconductor laser element and the second semiconductor laser element are connected in series;
the second wiring, the third wiring and the second semiconductor laser element are connected in series; and
the second wiring, the third wiring and the first semiconductor laser element are not connected in series.