US 12,126,092 B1
Antenna and PCB layout topology designs for frequency scalability in PCB technology for antenna arrays
Trang Thai, San Diego, CA (US); Jason L. Durbin, San Diego, CA (US); Vipul Jain, Irvine, CA (US); and Michael Coolen, San Diego, CA (US)
Assigned to Anokiwave, Inc., San Diego, CA (US)
Filed by Anokiwave, Inc., San Diego, CA (US)
Filed on Aug. 29, 2023, as Appl. No. 18/239,383.
Application 18/239,383 is a continuation of application No. 17/716,359, filed on Apr. 8, 2022, granted, now 11,749,889.
Claims priority of provisional application 63/173,116, filed on Apr. 9, 2021.
Int. Cl. H01Q 1/38 (2006.01); H01Q 1/22 (2006.01); H01Q 3/34 (2006.01); H01Q 21/06 (2006.01); H01Q 21/24 (2006.01)
CPC H01Q 3/34 (2013.01) [H01Q 1/2283 (2013.01); H01Q 21/06 (2013.01); H01Q 21/245 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A phased array system comprising:
a substrate;
a plurality of elements on the substrate;
first and second beamforming ICs on the substrate, each beamforming IC having a first and second element interface sets configured to be polarized in two different polarizations, a first common interface electrically coupled with the first set of element interfaces, and a second common interface electrically coupled with the second set of element interfaces;
a first interconnect element electrically coupling the first common interface of the first beamforming IC with the second common interface of the second beamforming IC; and
a second interconnect element electrically coupling the second common interface of the first beamforming IC with the first common interface of the second beamforming IC without the second interconnect element crossing over the first interconnect element.