US 12,126,069 B2
Cavity resonance suppression using discrete thermal pedestals in active electronically scanned array
Michael Buckley, Boyds, MD (US); Tom Walter, Germantown, MD (US); Bingqian Lu, Olney, MD (US); Lal Mohan Bhowmik, Montogomery Village, MD (US); and Varada Rajan Komanduri, Germantown, MD (US)
Assigned to Hughes Network Systems, LLC, Germantown, MD (US)
Filed by Hughes Network Systems, LLC, Germantown, MD (US)
Filed on Mar. 30, 2022, as Appl. No. 17/657,340.
Claims priority of provisional application 63/266,262, filed on Dec. 30, 2021.
Claims priority of provisional application 63/169,770, filed on Apr. 1, 2021.
Prior Publication US 2022/0321239 A1, Oct. 6, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04B 15/00 (2006.01); H01Q 1/02 (2006.01); H01Q 1/24 (2006.01); H01Q 1/42 (2006.01); H01Q 3/36 (2006.01); H05K 1/02 (2006.01)
CPC H01Q 1/02 (2013.01) [H01Q 1/24 (2013.01); H01Q 1/42 (2013.01); H01Q 3/36 (2013.01); H04B 15/00 (2013.01); H05K 1/0203 (2013.01); H05K 2201/10098 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An AESA (Active Electronically Scanned Array) comprising:
a PCB (Printed Circuit Board) substrate having an obverse surface;
TRMs (Transmit/Receive Modules) disposed on the obverse surface;
thermal pedestals wherein each thermal pedestal comprises a wall, having a wall height, comprising wall surfaces and one of the wall surfaces being a contact surface; and
a TIM (Thermal Interface Material), having a TIM height, disposed between a respective contact surface of the thermal pedestals and the obverse surface,
wherein the thermal pedestals are discrete with respect to one another,
the contact surfaces of the thermal pedestals are interspersed about the TRMs,
the thermal pedestals do not contact the TRMs,
the TIM is electrically and thermally conductive, and
the wall height plus the TIM height is sufficient to suppress resonances of the TRMs below a frequency greater than Tx and Rx frequency bands of the TRMs.