US 12,125,829 B2
Electronic device
Jen-Hai Chi, Miao-Li County (TW); Chia-Ping Tseng, Miao-Li County (TW); Chen-Lin Yeh, Miao-Li County (TW); and Yan-Zheng Wu, Miao-Li County (TW)
Assigned to InnoLux Corporation, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Jan. 5, 2023, as Appl. No. 18/093,331.
Application 18/093,331 is a continuation of application No. 17/106,197, filed on Nov. 30, 2020, granted, now 11,574,893.
Claims priority of application No. 202011127548.4 (CN), filed on Oct. 20, 2020.
Prior Publication US 2023/0154900 A1, May 18, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 25/07 (2006.01)
CPC H01L 25/072 (2013.01) [H01L 23/3121 (2013.01); H01L 23/481 (2013.01); H01L 23/49822 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a carrier having at least one bonding pad;
a plurality of electronic elements disposed on the carrier and at least one of the plurality of electronic elements comprising a through hole, at least two of the plurality of electronic elements comprising a substrate, wherein a distance between two adjacent substrates of the at least two of the plurality of electronic elements is not less than 300 μm; and
a connecting terminal disposed between the substrate of one of the plurality of electronic elements and the carrier, wherein the one of the plurality of electronic elements is electrically connected to the at least one bonding pad via the connecting terminal,
wherein the through hole is overlapped with the at least one bonding pad and the connecting terminal.