US 12,125,804 B2
Semiconductor package and manufacturing method thereof
Wei-Kang Hsieh, Hsinchu (TW); Hao-Yi Tsai, Hsinchu (TW); Tin-Hao Kuo, Hsinchu (TW); and Shih-Wei Chen, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Aug. 1, 2023, as Appl. No. 18/362,989.
Application 18/362,989 is a continuation of application No. 17/981,470, filed on Nov. 6, 2022.
Application 17/981,470 is a continuation of application No. 17/192,897, filed on Mar. 5, 2021, granted, now 11,515,268, issued on Nov. 29, 2022.
Prior Publication US 2023/0378098 A1, Nov. 23, 2023
Int. Cl. H01L 21/683 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/40 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/562 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/4006 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/96 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4087 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/95001 (2013.01); H01L 2924/3511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, having a central region and a peripheral region surrounding the central region, the semiconductor package comprising:
a plurality of pairs of first functional dies disposed in the center region; and
a plurality of first dummy dies disposed in the peripheral region,
wherein a size of the first functional dies is different from a size of the first dummy dies,
wherein an outmost pair of first functional dies is spaced from an edge of the semiconductor package by a non-zero distance, and
wherein each pair of first functional dies is encapsulated by a first encapsulant, the first encapsulant is encapsulated by a second encapsulant, and the second encapsulant is different from the first encapsulant.