US 12,125,799 B2
Embedded die packaging with integrated ceramic substrate
Woochan Kim, San Jose, CA (US); Mutsumi Masumoto, Oita (JP); Kengo Aoya, Oita (JP); Vivek Kishorechand Arora, San Jose, CA (US); and Anindya Poddar, Sunnyvale, CA (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Nov. 2, 2021, as Appl. No. 17/517,608.
Application 17/517,608 is a division of application No. 16/132,906, filed on Sep. 17, 2018, granted, now 11,183,460.
Prior Publication US 2022/0108955 A1, Apr. 7, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/5389 (2013.01) [H01L 21/568 (2013.01); H01L 23/3735 (2013.01); H01L 23/49861 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for fabricating a packaged electronic device, the method comprising:
attaching a semiconductor die to a conductive feature on an electrically insulating, thermally conductive substrate;
forming an electrically insulating lamination structure to enclose a portion of the semiconductor die, and a portion of the electrically insulating, thermally conductive substrate;
attaching the die and a frame to a carrier structure;
forming the electrically insulating lamination structure to enclose portions of the frame and the portions of the semiconductor die and the electrically insulating substrate; and
removing the carrier structure after forming the electrically insulating lamination structure.