| CPC H01L 23/5226 (2013.01) [H01L 23/298 (2013.01); H01L 23/3178 (2013.01); H01L 24/20 (2013.01)] | 20 Claims |
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1. A bonded structure comprising:
a first element including a first dielectric layer, a first conductive structure at least partially embedded in the first dielectric layer, and a second conductive structure at least partially embedded in the first dielectric layer, a cross-sectional width of the first conductive structure being greater than a width of the second conductive structure;
a second element including a second dielectric layer, a third conductive structure at least partially embedded in the second dielectric layer, and a fourth conductive structure at least partially embedded in the second dielectric layer, the first dielectric layer and the second dielectric layer being directly bonded to one another without an intervening adhesive, the first conductive structure and the third conductive structure being in contact with and bonded to one another; and
an embedded layer disposed partially between the first and the third conductive structures.
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