US 12,125,761 B2
Semiconductor package including package seal ring and methods for forming the same
Jen-Yuan Chang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed on Sep. 7, 2021, as Appl. No. 17/467,658.
Claims priority of provisional application 63/150,136, filed on Feb. 17, 2021.
Prior Publication US 2022/0262695 A1, Aug. 18, 2022
Int. Cl. H01L 23/16 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 27/06 (2006.01)
CPC H01L 23/3128 (2013.01) [H01L 21/568 (2013.01); H01L 23/16 (2013.01); H01L 23/481 (2013.01); H01L 23/5389 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 27/0688 (2013.01); H01L 2224/32146 (2013.01); H01L 2224/32233 (2013.01); H01L 2224/83005 (2013.01)] 20 Claims
OG exemplary drawing
 
9. A semiconductor package comprising:
a first die;
a second die stacked on the first die in a vertical direction;
a dielectric encapsulation (DE) structure surrounding the first die and the second die in a lateral direction perpendicular to the vertical direction; and
a package seal ring that extends through the first die, into the DE structure, and surrounds the second die in the lateral direction.