US 12,125,757 B2
Semiconductor package with stiffener structure and method forming the same
Wensen Hung, Hsinchu County (TW); Yu-Ling Tsai, Hsinchu (TW); Chien-Chia Chiu, Taoyuan (TW); and Tsung-Yu Chen, New Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jun. 17, 2023, as Appl. No. 18/336,960.
Application 18/336,960 is a continuation of application No. 17/314,002, filed on May 6, 2021, granted, now 11,721,602.
Prior Publication US 2023/0335449 A1, Oct. 19, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/12 (2006.01)
CPC H01L 23/31 (2013.01) [H01L 21/56 (2013.01); H01L 23/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a first component, disposed on a substrate;
a plurality of second components, disposed aside the first component on the substrate;
a stiffener structure, disposed on the substrate, the stiffener structure comprising:
a stiffener rib between the first component and the plurality of second components; and
a lid, attached to the stiffener structure, the first component and the plurality of second components,
wherein the lid comprises a recess portion over the stiffener rib, and a plurality of sidewalls of the lid exposed by the recess portion surround the second portion of the stiffener rib.