US 12,125,754 B2
Sensor package substrate, sensor module including the same, and electronic component embedded substrate
Kazutoshi Tsuyutani, Tokyo (JP); Yoshihiro Suzuki, Tokyo (JP); and Akira Motohashi, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Aug. 24, 2022, as Appl. No. 17/894,584.
Application 17/894,584 is a continuation of application No. 16/550,995, filed on Aug. 26, 2019, granted, now 11,462,447.
Claims priority of application No. 2018-133591 (JP), filed on Jul. 13, 2018.
Prior Publication US 2022/0406670 A1, Dec. 22, 2022
Int. Cl. H01L 23/13 (2006.01); G01H 3/00 (2006.01); G01K 13/02 (2021.01); G01L 9/00 (2006.01); G01N 33/00 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2023.01)
CPC H01L 23/13 (2013.01) [G01H 3/00 (2013.01); G01K 13/02 (2013.01); G01L 9/0041 (2013.01); G01N 33/0027 (2013.01); H01L 23/5389 (2013.01); H01L 25/18 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A sensor package substrate comprising:
a mounting area which is provided on one surface thereof for mounting a sensor chip; and
an electronic component connected to the sensor chip,
wherein a through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the sensor package substrate from the one surface to another surface thereof,
wherein the mounting area and the electronic component overlap each other in a plan view,
wherein the through hole has a first section positioned at a side of the one surface and a second section positioned at a side of the another surface, and a third section positioned between the first and second sections,
wherein a center axis of the first section of the through hole is offset from a center axis of the second section of the through hole,
wherein a diameter of the first section of the through hole is a same as a diameter of the second section of the through hole,
wherein the sensor package substrate has a configuration in which a plurality of insulating layers are stacked on one another,
wherein the plurality of insulating layers includes a first insulating layer containing a core material and a second insulating layer not containing a core material, and
wherein the third section of the through hole is positioned at the second insulating layer so as not to expose the core material from an inner wall of the through hole at the third section.