US 12,125,727 B2
Wafer transfer system and a method for transporting wafers
Ren-Hau Wu, New Taipei (TW); Cheng-Kang Hu, Kaohsiung (TW); Chieh-Chun Lin, Hsinchu (TW); Jia-Hong Liao, Hsinchu (TW); and Cheng-Yi Liu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Aug. 24, 2022, as Appl. No. 17/894,862.
Claims priority of provisional application 63/340,780, filed on May 11, 2022.
Claims priority of provisional application 63/329,243, filed on Apr. 8, 2022.
Prior Publication US 2023/0326776 A1, Oct. 12, 2023
Int. Cl. H01L 21/677 (2006.01); H01L 21/673 (2006.01)
CPC H01L 21/67724 (2013.01) [H01L 21/67389 (2013.01)] 20 Claims
OG exemplary drawing
 
12. A method for transporting wafers, comprising:
docking a cart in a first workstation;
loading a wafer holder into a space of the cart;
after the loading, pressurizing the space of the cart in the first workstation to cause a pressure of the space of the cart to be greater than an atmospheric pressure;
after the pressurization, maintaining the pressure of the space at the pressure greater than an atmospheric pressure; and
moving the cart carrying the wafer holder away from the first workstation.