US 12,125,725 B2
Integrated semiconductor die vessel processing workstations
Tsung-Sheng Kuo, Hsin-Chu (TW); Guan-Wei Huang, Hsin-Chu (TW); Chih-Hung Huang, Hsin-Chu (TW); Yang-Ann Chu, Hsin-Chu (TW); Hsu-Shui Liu, Pingjhen (TW); and Jiun-Rong Pai, Jhubei (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jul. 14, 2023, as Appl. No. 18/222,328.
Application 17/874,174 is a division of application No. 16/518,352, filed on Jul. 22, 2019, granted, now 11,488,848.
Application 18/222,328 is a continuation of application No. 17/874,174, filed on Jul. 26, 2022, granted, now 11,721,572.
Claims priority of provisional application 62/712,656, filed on Jul. 31, 2018.
Prior Publication US 2023/0360939 A1, Nov. 9, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); H01L 21/02 (2006.01); H01L 21/66 (2006.01)
CPC H01L 21/67288 (2013.01) [H01L 21/02057 (2013.01); H01L 21/67051 (2013.01); H01L 22/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A workstation, comprising:
a disassembly station configured to receive a die vessel, determine whether the die vessel comprises a first type of die vessel or a second type of die vessel, and disassemble multiple parts of the die vessel when the die vessel comprises the first type of die vessel; and
a weight sensor configured to measure a weight of the die vessel, and wherein the disassembly station determines whether the die vessel comprises the first or second type of die vessel based on an output of the weight sensor.
 
8. A system, comprising:
a die vessel configured to secure a semiconductor die;
a disassembly station configured to receive the die vessel, determine whether the die vessel comprises a first type of die vessel or a second type of die vessel, and disassemble multiple parts of the die vessel when the die vessel comprises the first type of die vessel;
a conveyor configured to move the one or more parts of the die vessel between the disassembly station and at least one other station, wherein the conveyor is configured to move the one or more parts of the die vessel to a pass output port or a fail output port based on whether the one or more parts of the die vessel is identified as passing an inspection when the die vessel comprises either the first type of die vessel or the second type of die vessel; and
a weight sensor configured to measure a weight of the die vessel, and wherein the disassembly station determines whether the die vessel comprises the first or second type of die vessel based on an output of the sensor.