US 12,125,715 B2
Chip package structure with nickel layer
Kuo-Ching Hsu, Taipei (TW); Yu-Huan Chen, Taoyuan (TW); and Chen-Shien Chen, Zhubei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jun. 26, 2023, as Appl. No. 18/341,052.
Application 18/341,052 is a continuation of application No. 17/717,520, filed on Apr. 11, 2022, granted, now 11,728,180.
Application 17/717,520 is a continuation of application No. 16/837,381, filed on Apr. 1, 2020, granted, now 11,302,537, issued on Apr. 12, 2022.
Prior Publication US 2023/0335411 A1, Oct. 19, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01)
CPC H01L 21/4853 (2013.01) [H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81035 (2013.01); H01L 2224/81047 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81395 (2013.01); H01L 2224/81411 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81455 (2013.01); H01L 2224/81493 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A chip package structure, comprising:
a wiring substrate comprising a substrate, a first pad, and a second pad, wherein the first pad and the second pad are respectively over a first surface and a second surface of the substrate, and the first pad is narrower than the second pad;
a nickel layer over the first pad, wherein the nickel layer has a T-shape in a cross-sectional view of the nickel layer;
a chip over the wiring substrate;
a conductive bump between the nickel layer and the chip; and
a conductive adhesive layer over the first pad, wherein the nickel layer is over the conductive adhesive layer, the nickel layer has a first lower surface and a bottom surface, the first lower surface is higher than the bottom surface, the conductive adhesive layer has a second lower surface, and the first lower surface is substantially level with the second lower surface.