CPC G11B 5/3909 (2013.01) [G11B 5/11 (2013.01); G11B 5/3912 (2013.01); G11B 5/3932 (2013.01); G11B 5/3967 (2013.01); G11B 2005/3996 (2013.01)] | 13 Claims |
1. A sensor, comprising:
a seed layer;
a magnetic tunnel junction (MTJ) structure disposed over the seed layer;
a first buffer layer disposed over the MTJ structure;
a bismuth antimony (BiSb) layer disposed over the first buffer layer;
a second buffer layer disposed over the BiSb layer;
a capping layer disposed over the second buffer layer, wherein the seed layer, the MTJ structure, the first buffer layer, the BiSb layer, the second buffer layer, and the capping layer are disposed at a media facing surface (MFS); and
an antiferromagnetic (AFM) layer, wherein the AFM layer is adjacent to the MTJ structure.
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