US 12,124,179 B2
Method of wafer alignment using at resolution metrology on product features
Wim Tjibbo Tel, Veldhoven (NL); Hermanus Adrianus Dillen, Veldhoven (NL); Marc Jurian Kea, Morgan Hill, CA (US); Roy Werkman, Eindhoven (NL); and Weitian Kou, Eindhoven (NL)
Assigned to ASML NETHERLANDS B.V., Veldhoven (NL)
Appl. No. 17/920,014
Filed by ASML NETHERLANDS B.V., Veldhoven (NL)
PCT Filed May 11, 2021, PCT No. PCT/EP2021/062417
§ 371(c)(1), (2) Date Oct. 19, 2022,
PCT Pub. No. WO2021/228811, PCT Pub. Date Nov. 18, 2021.
Claims priority of provisional application 63/180,910, filed on Apr. 28, 2021.
Claims priority of application No. 20174607 (EP), filed on May 14, 2020; and application No. 20208071 (EP), filed on Nov. 17, 2020.
Prior Publication US 2023/0168594 A1, Jun. 1, 2023
Int. Cl. G03F 9/00 (2006.01)
CPC G03F 9/7023 (2013.01) [G03F 9/7088 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of determining a distortion component of a substrate, the method comprising:
obtaining a plurality of position measurements of one or more product features on, or in, a surface of a substrate and of one or more alignment marks of the substrate, wherein the measurements of the one or more product features are referenced to either a positioning system used in displacing the substrate or a plane parallel to the surface of the substrate; and
determining, by a hardware apparatus, a distortion component of the substrate based on the plurality of position measurements.