CPC G03F 7/16 (2013.01) [G05B 13/027 (2013.01); G06T 7/001 (2013.01); G06T 7/60 (2013.01); H01L 21/0273 (2013.01); H01L 22/20 (2013.01); H04N 23/90 (2023.01); G06T 2207/20081 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/30148 (2013.01)] | 20 Claims |
1. A method for manufacturing a semiconductor device, comprising:
obtaining a first image of a fluid dispense nozzle using a first camera, the fluid dispense nozzle configured to dispense fluid on a semiconductor substrate;
obtaining a second image of the fluid dispense nozzle using a second camera, the second image having a higher resolution than the first image;
determining a width of the fluid dispense nozzle at multiple intervals along the fluid dispense nozzle and a width of a spray pattern of a fluid being dispensed from the fluid dispense nozzle at multiple intervals along the spray pattern;
fitting a first straight line to a series of data points representing a plurality of widths of the intervals along the fluid dispense nozzle and a plurality of widths of the intervals along the spray pattern;
determining a first slope of the first straight line; and
determining a condition of the spray pattern and the fluid dispense nozzle based on the first slope.
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