US 12,124,149 B2
Electrophoretic display device and manufacturing method thereof
Hsiao-Lung Cheng, Hsinchu (TW); Pei-Lin Tien, Hsinchu (TW); I-Shin Lo, Hsinchu (TW); and Chi-Mao Hung, Hsinchu (TW)
Assigned to E Ink Holdings Inc., Hsinchu (TW)
Filed by E Ink Holdings Inc., Hsinchu (TW)
Filed on Jul. 8, 2021, as Appl. No. 17/371,067.
Claims priority of application No. 109128358 (TW), filed on Aug. 20, 2020.
Prior Publication US 2022/0057689 A1, Feb. 24, 2022
Int. Cl. G02F 1/16756 (2019.01); G02F 1/167 (2019.01); G02F 1/16755 (2019.01); G02F 1/1676 (2019.01); G02F 1/1679 (2019.01)
CPC G02F 1/16756 (2019.01) [G02F 1/167 (2013.01); G02F 1/16755 (2019.01); G02F 1/1676 (2019.01); G02F 1/1679 (2019.01)] 10 Claims
OG exemplary drawing
 
1. An electrophoretic display device, comprising:
a substrate;
a first conductive layer, disposed on the substrate, and comprising a plurality of background patterns and a plurality of signal lines, wherein each of the signal lines is located between two adjacent background patterns;
a plurality of insulating patterns, wherein each of the insulating patterns covers the each of the signal lines and bridges to the two adjacent background patterns;
a second conductive layer, comprising a plurality of conductive patterns, wherein each of the conductive patterns covers the each of the insulating patterns and bridges to the two adjacent background patterns, and each of the conductive patterns is in direct contact with the two adjacent the background patterns, wherein a projection of the second conductive layer on the substrate overlaps a projection of the signal line on the substrate;
an adhesive layer, disposed on and in direct contact with the background pattern and the second conductive layer; and
an electrophoretic display film, disposed above the adhesive layer.