US 12,124,087 B2
Wideband surface coupling
Abraham Israel, Jerusalem (IL); and Hesham Taha, Jerusalem (IL)
Assigned to Teramount Ltd., Jerusalem (IL)
Filed by Teramount Ltd., Jerusalem (IL)
Filed on Dec. 14, 2020, as Appl. No. 17/120,816.
Application 17/120,816 is a continuation of application No. 16/386,859, filed on Apr. 17, 2019, granted, now 10,866,363, issued on Dec. 15, 2020.
Application 16/386,859 is a continuation in part of application No. 15/797,792, filed on Oct. 30, 2017, granted, now 10,481,334, issued on Nov. 19, 2019.
Application 15/797,792 is a continuation of application No. 14/878,591, filed on Oct. 8, 2015, granted, now 9,804,334, issued on Oct. 31, 2017.
Claims priority of provisional application 62/659,376, filed on Apr. 18, 2018.
Prior Publication US 2021/0165165 A1, Jun. 3, 2021
Prior Publication US 2023/0037280 A9, Feb. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G02B 6/12 (2006.01); G02B 6/30 (2006.01)
CPC G02B 6/305 (2013.01) 28 Claims
OG exemplary drawing
 
1. A method for use with a wideband photonic bump (WBB) including a positive taper of a polymer waveguide, a tilted flat mirror of the WBB, and a curved mirror of the WBB, the method comprising:
expanding, by the positive taper, a light beam received from an inverse taper of a photonic integrated circuit (PIC) to match a fiber optical mode of an optical fiber;
reflecting the light beam from the positive taper toward a curved mirror of a photonic plug formed on a surface of the photonic plug using the tilted flat mirror of the WBB; and
directing, by the curved mirror of the WBB, a version of the reflected light beam received from the curved mirror of the photonic plug toward a tilted flat mirror of the photonic plug.