US 12,124,078 B2
Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same
Kuan-Yu Huang, Taipei (TW); Yu-Yun Huang, Hsinchu (TW); Tien-Yu Huang, Chiayi County (TW); Sung-Hui Huang, Yilan County (TW); Sen-Bor Jan, Tainan (TW); and Shang-Yun Hou, Jubei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed on Dec. 13, 2021, as Appl. No. 17/548,660.
Claims priority of provisional application 63/187,971, filed on May 13, 2021.
Prior Publication US 2022/0365274 A1, Nov. 17, 2022
Int. Cl. G02B 6/12 (2006.01); G02B 6/124 (2006.01); G02B 6/13 (2006.01)
CPC G02B 6/12002 (2013.01) [G02B 6/124 (2013.01); G02B 6/13 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package assembly, comprising:
a package substrate comprising a first die that includes a photonic integrated circuit;
a second die located on the first die, the second die comprising an electronic integrated circuit electrically connected to the photonic integrated circuit; and
an interposer module comprising a die on the package substrate, wherein at least a portion of the interposer module is located on the first die and electrically connected to the photonic integrated circuit.