US 12,124,064 B2
Solid-state imaging device and electronic apparatus
Atsushi Toda, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed on Jan. 24, 2022, as Appl. No. 17/582,143.
Application 17/582,143 is a continuation of application No. 16/491,682, granted, now 11,231,534, previously published as PCT/JP2018/007687, filed on Mar. 1, 2018.
Claims priority of application No. 2017-050789 (JP), filed on Mar. 16, 2017.
Prior Publication US 2022/0146726 A1, May 12, 2022
Int. Cl. H01L 27/146 (2006.01); G02B 5/28 (2006.01); G02B 6/42 (2006.01); G02B 27/00 (2006.01); H01L 31/0232 (2014.01); H04N 25/70 (2023.01)
CPC G02B 5/28 (2013.01) [G02B 5/285 (2013.01); G02B 6/4206 (2013.01); G02B 27/0025 (2013.01); H01L 27/14625 (2013.01); H01L 31/0232 (2013.01); H04N 25/70 (2023.01)] 13 Claims
OG exemplary drawing
 
1. A solid-state imaging device, comprising:
a semiconductor substrate including a photoelectric conversion element;
a plurality of pillar structures above the semiconductor substrate in a cross-sectional view; and
a filter element between the semiconductor substrate and the plurality of pillar structures in the cross-sectional view, wherein
the plurality of pillar structures is configured to correct a first direction of an incident light to a light in a second direction, and
the second direction is perpendicular to the photoelectric conversion element, and wherein
a correcting power, to correct the first direction of the incident light to the light in the second direction, varies based on a size of image height with reference to a center of an imaging surface of the solid-state imaging device.