US 12,124,035 B2
Stretchable film assembly with conductive traces
Belgacem Haba, Saratoga, CA (US); Ilyas Mohammed, Santa Clara, CA (US); Gabriel Z. Guevara, Gilroy, CA (US); and Min Tao, San Jose, CA (US)
Assigned to Adeia Semiconductor Technologies LLC, San Jose, CA (US)
Filed by Adeia Semiconductor Technologies LLC, San Jose, CA (US)
Filed on Feb. 22, 2021, as Appl. No. 17/182,016.
Application 17/182,016 is a division of application No. 16/136,776, filed on Sep. 20, 2018, granted, now 10,955,671.
Claims priority of provisional application 62/636,975, filed on Mar. 1, 2018.
Prior Publication US 2021/0181511 A1, Jun. 17, 2021
Int. Cl. H01L 21/78 (2006.01); G02B 27/01 (2006.01)
CPC G02B 27/0172 (2013.01) [G02B 2027/0134 (2013.01); G02B 2027/015 (2013.01); G09G 2370/18 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method for forming a stretchable film assembly with conductive traces, the method comprising:
obtaining a base comprising a section with alternating ridges and grooves;
forming an etch stop layer over the base conformably with the alternating ridges and grooves;
forming conductive traces over the etch stop layer conformably with the alternating ridges and grooves;
forming a film assembly comprising a stretchable dielectric film disposed on the conductive traces conformably with the alternating ridges and grooves, the film assembly disposed on the base; and
removing the film assembly from the base by etching the base to the etch stop layer to form the stretchable film assembly.