US 12,123,906 B2
Electronic device inspection apparatus
Kazuya Itose, Tokyo (JP); Tetsuhiro Fukao, Tokyo (JP); Motoyoshi Koyanagi, Tokyo (JP); Yohei Mikami, Tokyo (JP); Masafumi Takeda, Tokyo (JP); and Yasuhiro Yamauchi, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Appl. No. 17/907,639
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed May 13, 2020, PCT No. PCT/JP2020/019103
§ 371(c)(1), (2) Date Sep. 28, 2022,
PCT Pub. No. WO2021/229714, PCT Pub. Date Nov. 18, 2021.
Prior Publication US 2023/0131641 A1, Apr. 27, 2023
Int. Cl. G01R 31/26 (2020.01)
CPC G01R 31/2601 (2013.01) 20 Claims
OG exemplary drawing
 
1. An electronic device inspection apparatus comprising:
an inspection table to position and hold an electrode disposed in an electronic device;
at least one contact element formed of a shape memory alloy in a long and thin plate shape, one end side of the contact element being fixed to the holding mechanism, the other end side thereof being formed in a shape of a spiral at a first temperature and being developed from the spiral at a second temperature; and
a measurement circuitry to measure the electronic device by conducting a current into the electrode via the contact element, wherein
an axis of the spiral in the other end side is parallel to a face of the positioned electrode, and a contact region is formed along a longitudinal direction between the other end side and the positioned electrode at the second temperature.