CPC G01N 27/4145 (2013.01) [H01L 23/481 (2013.01); H01L 23/5226 (2013.01)] | 20 Claims |
1. A method of fabricating a biosensor system package comprising:
providing a substrate, the substrate including a semiconductor layer having a front side and a back side, a buried oxide (BOX) layer at the back side, and a bulk silicon layer at the back side;
forming a transistor structure on the substrate, wherein a channel region of the transistor structure is in the semiconductor layer;
forming a multi-layer interconnect (MLI) structure on the front side of the semiconductor layer, wherein the MLI structure is electrically connected to the transistor structure;
attaching a carrier substrate to the MLI structure;
removing the bulk silicon layer;
etching the BOX layer to form an opening at the back side over the channel region;
depositing an interface layer on the back side over the channel region;
fabricating a microfluidic channel cap structure;
bonding the microfluidic channel cap structure to the BOX layer;
thinning the carrier substrate;
creating a first through substrate via (TSV) structure extending through the carrier substrate, the first TSV structure electrically connected to the MLI structure; and
thinning the microfluidic channel cap structure to form at least one port for inflow and outflow of fluid samples.
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