US 12,123,778 B2
Thermal imaging sensor for integration into track system
Michael Carcasi, Austin, TX (US); Kazuhiro Shiba, Koshi (JP); Masahide Tadokoro, Koshi (JP); Masashi Enomoto, Koshi (JP); and Toyohisa Tsuruda, Koshi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Mar. 4, 2021, as Appl. No. 17/192,520.
Claims priority of provisional application 62/987,782, filed on Mar. 10, 2020.
Prior Publication US 2021/0285822 A1, Sep. 16, 2021
Int. Cl. G01J 5/00 (2022.01); H04N 5/33 (2023.01)
CPC G01J 5/0007 (2013.01) [H04N 5/33 (2013.01); G01J 2005/0077 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A system, comprising:
at least one processing module for processing a substrate;
a thermal imaging sensor positioned within the at least one processing module to obtain thermal data from the substrate, a liquid dispensed onto the substrate, or a component included within the at least one processing module, wherein the at least one processing module is a liquid dispense module, and wherein the thermal imaging sensor is mounted onto a nozzle scan arm included within the liquid dispense module, wherein the thermal imaging sensor is positioned to have a field of view that includes the substrate or spin chuck; and
a controller coupled to receive the thermal data from the thermal imaging sensor and configured to process the thermal data for fault detection monitoring, process control, substrate evaluation, equipment evaluation, process evaluation, or end-of-life prediction.