US 12,123,746 B2
Sensor with housing and silicone resin filler
Abraham Kho, Singapore (SG); Andi Permana, Kepri (ID); and Heinz Strallhofer, Deutschlandsberg (AT)
Assigned to TDK Electronics AG, Munich (DE)
Appl. No. 17/633,334
Filed by TDK Electronics AG, Munich (DE)
PCT Filed Jun. 15, 2021, PCT No. PCT/EP2021/066067
§ 371(c)(1), (2) Date Feb. 7, 2022,
PCT Pub. No. WO2021/255005, PCT Pub. Date Dec. 23, 2021.
Claims priority of application No. 102020116018.6 (DE), filed on Jun. 17, 2020.
Prior Publication US 2022/0291053 A1, Sep. 15, 2022
Int. Cl. G01D 11/24 (2006.01); G01K 1/08 (2021.01); G01R 22/00 (2006.01)
CPC G01D 11/245 (2013.01) [G01K 1/08 (2013.01); G01R 22/00 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A sensor comprising:
a sensor element;
electrical leads connected to the sensor element;
a housing, having an opening, wherein the sensor element is arranged in the housing such that the electrical leads protrude through the opening; and
a first silicone resin filling the housing such that the sensor element and the electrical leads are fixed in the housing,
wherein the housing is divided into a first portion and a second portion,
wherein the first portion comprises the opening,
wherein the second portion is located opposite the opening and connected to the first portion,
wherein an extend of the second portion is smaller than an extend of the first portion, and
wherein the sensor element is arranged in the second portion of the housing.