US 12,123,744 B2
Distance measuring device
Sho Nishida, Tokyo (JP); Kenta Endo, Tokyo (JP); Kei Nakagawa, Tokyo (JP); and Takao Tanikame, Tokyo (JP)
Assigned to SONY GROUP CORPORATION, Tokyo (JP)
Appl. No. 17/436,171
Filed by SONY GROUP CORPORATION, Tokyo (JP)
PCT Filed Feb. 12, 2020, PCT No. PCT/JP2020/005311
§ 371(c)(1), (2) Date Sep. 3, 2021,
PCT Pub. No. WO2020/189101, PCT Pub. Date Sep. 24, 2020.
Claims priority of application No. 2019-050071 (JP), filed on Mar. 18, 2019.
Prior Publication US 2022/0136826 A1, May 5, 2022
Int. Cl. G01C 3/06 (2006.01); G01C 3/08 (2006.01); G01S 7/4914 (2020.01); G01S 7/4915 (2020.01); G01S 17/894 (2020.01); G01S 17/931 (2020.01); H01L 31/0203 (2014.01); H01L 31/0216 (2014.01); H01L 31/0232 (2014.01); H01L 31/107 (2006.01)
CPC G01C 3/06 (2013.01) [G01S 7/4914 (2013.01); G01S 7/4915 (2013.01); G01S 17/894 (2020.01); G01S 17/931 (2020.01); H01L 31/0203 (2013.01); H01L 31/02164 (2013.01); H01L 31/0232 (2013.01); H01L 31/107 (2013.01); G01C 3/08 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A distance measuring device, comprising:
a light-receiving section that includes:
a semiconductor substrate;
a first light-receiving pixel;
a second light-receiving pixel;
a light-shielded pixel that is light-shielded, wherein
each of the first light-receiving pixel, the light-shielded pixel, and the second light-receiving pixel includes a light-receiving element in the semiconductor substrate,
each of the first light-receiving pixel and the second light-receiving pixel is configured to detect first light, and
the first light-receiving pixel, the light-shielded pixel, and the second light-receiving pixel are disposed in a first direction in this order; and
a light-shielding wall in the semiconductor substrate, wherein the light-shielding wall is between the light-receiving element of the first light-receiving pixel and the light-receiving element of the light-shielded pixel; and
a processor configured to measure a distance to a measurement object based on the detected first light.