US 12,123,103 B2
Film forming apparatus for forming metal film and film forming method for forming metal film
Haruki Kondoh, Okazaki (JP)
Assigned to TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP)
Filed by TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP)
Filed on Oct. 11, 2022, as Appl. No. 18/045,512.
Claims priority of application No. 2021-168472 (JP), filed on Oct. 14, 2021.
Prior Publication US 2023/0122871 A1, Apr. 20, 2023
Int. Cl. C25D 21/12 (2006.01); C25D 17/00 (2006.01)
CPC C25D 21/12 (2013.01) [C25D 17/002 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A film forming apparatus for forming a metal film, comprising:
an anode;
a solid electrolyte membrane disposed between the anode and a substrate that serves as a cathode;
a power supply configured to apply a current between the anode and the substrate;
a mount base on which the substrate is placed; and
a housing including a storing chamber that stores an electrolytic solution together with the anode and having the solid electrolyte membrane attached thereto so as to seal the storing chamber;
wherein
the current is applied in a state where the solid electrolyte membrane is pressed against the substrate with a fluid pressure of the electrolytic solution in the storing chamber to form a metal film from metal ions contained in the electrolytic solution on a surface of the substrate; and
the mount base includes a liquid discharge port configured to discharge the electrolytic solution having passed through the solid electrolyte membrane from a position facing an end face of a side wall of the housing;
wherein
the mount base includes a housing recess that is formed in accordance with a shape of the substrate as a recess for placement,
the liquid discharge port includes a liquid discharge groove, and
the liquid discharge groove is formed to surround the housing recess with a distance from an edge of the housing recess.