	US 12,122,944 B2
	Hot melt adhesive composition
Yuzuru Takahashi, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 17/616,084
Filed by Showa Denko Materials Co., Ltd., Tokyo (JP)
PCT Filed Dec. 19, 2019, PCT No. PCT/JP2019/049936 § 371(c)(1), (2) Date Dec. 2, 2021, PCT Pub. No. WO2020/246063, PCT Pub. Date Dec. 10, 2020.
Claims priority of application No. 2019-105977 (JP), filed on Jun. 6, 2019.
Prior Publication US 2022/0315804 A1, Oct. 6, 2022
Int. Cl. C09J 5/06 (2006.01); C09J 123/08 (2006.01); C09J 191/06 (2006.01)

CPC C09J 5/06 (2013.01) [C09J 123/0815 (2013.01); C09J 123/0853 (2013.01); C09J 191/06 (2013.01)]

8 Claims

1. A hot melt adhesive composition, containing:

a 1-butene homopolymer;

an ethylene-based polymer having a melting point of lower than 80° C.;

an α-olefin copolymer having a melting point of 80° C. or higher;

a tackifying resin;

wax; and

a liquid softener,

wherein the ethylene-based polymer includes at least one type of copolymer selected from the group consisting of an ethylene·α-olefin copolymer and an ethylene· vinyl acetate copolymer.