CPC C09D 183/08 (2013.01) [C08G 77/08 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08G 77/24 (2013.01); C08J 5/18 (2013.01); C08K 5/01 (2013.01); C08K 5/03 (2013.01); C08K 5/07 (2013.01); C08K 5/14 (2013.01); C08K 5/5419 (2013.01); C08L 83/04 (2013.01); C08K 2201/019 (2013.01); C08L 2203/16 (2013.01); C08L 2312/06 (2013.01); C08L 2312/08 (2013.01)] | 16 Claims |
1. A curable organopolysiloxane composition for forming a film, comprising:
a curing reactive organopolysiloxane;
a curing agent; and
one or more organic solvents selected from the group consisting of (D1) organic polar solvents, (D2) low molecular weight siloxane solvents, (D3) halogen solvents, and mixed solvents thereof;
wherein the viscosity of the entire composition measured at a shear rate of 0.1 (s−1) at 25° C. is 100,000 mPa·s or less, and the viscosity of the entire composition measured at a shear rate of 10.0 (s−1) is within a range of 5 to 50,000 mPa·s,
wherein the thixotropic ratio, which is a ratio of the viscosity of the entire composition measured at a shear rate of 0.1 (s−1) to the viscosity of the entire composition measured at a shear rate of 10.0 (s−1), is 25.0 or less; and
wherein an organopolysiloxane cured product, obtained by curing the curable organopolysiloxane composition, has a dielectric constant measured at 1 KHz and 25° C. of 3 or higher.
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