US 12,122,883 B2
Method for producing radiation-sensitive resin composition
Takumi Tanaka, Shizuoka (JP); Hiroyuki Ezoe, Shizuoka (JP); and Kenichi Harada, Shizuoka (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Nov. 23, 2021, as Appl. No. 17/534,397.
Application 17/534,397 is a continuation of application No. PCT/JP2020/018971, filed on May 12, 2020.
Claims priority of application No. 2019-117232 (JP), filed on Jun. 25, 2019.
Prior Publication US 2022/0081518 A1, Mar. 17, 2022
Int. Cl. C08J 3/09 (2006.01); C08J 3/00 (2006.01); C08J 3/02 (2006.01); C08K 5/09 (2006.01); C08L 25/18 (2006.01)
CPC C08J 3/005 (2013.01) [C08K 5/09 (2013.01); C08L 25/18 (2013.01); C08J 2325/18 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for producing a radiation-sensitive resin composition comprising:
a step 1 of putting at least a resin having a polarity that increases by an action of an acid, a photoacid generator, and a solvent into a stirring tank; and
a step 2 of producing a radiation-sensitive resin composition by stirring and mixing the resin having a polarity that increases by the action of an acid, the photoacid generator, and the solvent in the stirring tank under a gas having an inert gas concentration of 90% by volume or more,
wherein in the step 2, an atmospheric pressure inside the stirring tank is higher than an atmospheric pressure outside the stirring tank, and
in the step 2, a difference between the atmospheric pressure inside the stirring tank and the atmospheric pressure outside the stirring tank is 2.0 kPa or less.