US 12,122,669 B2
Method of manufacturing laminate
Ken Kitamoto, Saitama (JP); and Ryoya Nakamura, Saitama (JP)
Assigned to Enplas Corporation, Saitama (JP)
Filed by Enplas Corporation, Saitama (JP)
Filed on Mar. 16, 2022, as Appl. No. 17/695,889.
Prior Publication US 2023/0294979 A1, Sep. 21, 2023
Int. Cl. B81C 1/00 (2006.01)
CPC B81C 1/00071 (2013.01) [B81C 2201/034 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A method of manufacturing a laminate, the method comprising:
preparing a substrate having a recess;
disposing a film on the substrate so as to cover the recess; and
obtaining a laminate by thermocompression bonding between the film and the substrate by pressing the film and the substrate with a first elastic body and a second elastic body in a state in which the substrate on which the film is disposed is disposed between the first elastic body and the second elastic body such that the film is on a first elastic body side, wherein
the first elastic body is harder than the second elastic body, and
the substrate is a resin mold obtained by injection molding.