US 12,122,545 B2
Bundling device and cable processing system
An (Joshua) Yang, Shanghai (CN); and Lvhai (Samuel) Hu, Shanghai (CN)
Assigned to Tyco Electronics (Shanghai) Co., Ltd., Shanghai (CN)
Filed by Tyco Electronics (Shanghai) Co., Ltd., Shanghai (CN)
Filed on Apr. 21, 2022, as Appl. No. 17/726,173.
Claims priority of application No. 202110433042.4 (CN), filed on Apr. 21, 2021.
Prior Publication US 2022/0344076 A1, Oct. 27, 2022
Int. Cl. B65B 27/10 (2006.01); B65B 13/04 (2006.01); B65B 13/28 (2006.01)
CPC B65B 27/10 (2013.01) [B65B 13/04 (2013.01); B65B 13/28 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A bundling device, comprising:
a frame; and
a wire bending device mounted to the frame and adapted to bend a bundling wire into an open ring to partially surround an object to be bundled and guide the bundling wire into a wire twisting device, the wire twisting device mounted to the frame and adapted to twist two opposite end segments of the bundling wire together to bundle the object, the wire bending device includes:
a wire bending mechanism pivotally mounted on the frame and configured to engage the bundling wire and bend the bundling wire into the open ring, the wire bending mechanism has a first end and a second end opposite to each other, and the second end is configured to engage with the bundling wire when bending the bundling wire;
a second driving mechanism configured to drive the wire bending mechanism to pivot; and
a connecting member, one end of the connecting member is connected to the second driving mechanism, and the opposite end of the connecting member is rotatably connected with the first end of the wire bending mechanism, an upper surface of the connecting member includes a first flat section and a second flat section connected by an inclined section, the second flat section is higher than the first flat section.