US 12,122,162 B2
Method for manufacturing liquid discharge head and liquid discharge head
Takumi Shimoda, Kanagawa (JP); Kazuaki Shibata, Kanagawa (JP); Atsunori Terasaki, Kanagawa (JP); Toshiyasu Sakai, Kanagawa (JP); and Ryoji Kanri, Kanagawa (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on May 24, 2022, as Appl. No. 17/751,916.
Claims priority of application No. 2021-091675 (JP), filed on May 31, 2021; and application No. 2022-045262 (JP), filed on Mar. 22, 2022.
Prior Publication US 2022/0388309 A1, Dec. 8, 2022
Int. Cl. B41J 2/16 (2006.01); B41J 2/14 (2006.01)
CPC B41J 2/1646 (2013.01) [B41J 2/14129 (2013.01); B41J 2/1603 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method for manufacturing a liquid
discharge head comprising:
a substrate;
a protective layer covering at least a part of the substrate; and
a laminate member formed on the protective layer,
the method comprising:
a step of forming the protective layer on the at least the part of the substrate; and
a step of forming the laminate member on the protective layer with a part of the protective layer exposed,
wherein the protective layer comprises at least Si and C,
wherein a content of oxygen in a bulk of the protective layer is less than 20 atomic % in terms of an element composition ratio,
wherein a modified layer with a content of oxygen of 20 atomic % or more in terms of an element composition ratio is present on a surface of the protective layer, and
wherein a thickness of the modified layer between the protective layer and the laminate member is 3.40 nm or less.