CPC B29C 63/481 (2013.01) [B29C 63/0004 (2013.01); B29C 63/0065 (2013.01); B29C 63/024 (2013.01); B29C 2063/0008 (2013.01); B29C 2063/483 (2013.01); B29L 2011/0016 (2013.01)] | 8 Claims |
1. A production line for processing a component, the production line comprising:
a loading device for providing the component;
a cleaning device for cleaning the component;
a detecting device for detecting the cleaned component and determine whether the cleaned component satisfies a cleaning standard;
a pasting device for pasting a protection film on the component when the component is determined to satisfy the cleaning standard;
a heat-sealing device for heat-sealing an anti-static film on the component pasted with the protection film;
a packing device for packing the component heat-sealed with the anti-static film; and
transfer devices disposed among at least two of the loading device, the cleaning device, the detecting device, the pasting device, the heat-sealing device, and the packing device, and the transfer devices for transferring the component, each of the transfer devices comprising a first guide rail and mechanism arms;
wherein the loading device, the cleaning device, the detecting device, the pasting device, the heat-sealing device, and the packing device are connected by the first guide rail, the mechanism arms are disposed on the first guide rail for transferring the component;
the cleaning device comprises:
a first blowing apparatus for executing a first blowing process on the component;
a first wiper apparatus for executing a first wiping process on the component;
a second wiper apparatus for executing a second wiping process on the component; and
a second blowing apparatus for executing a second blowing process on the component,
wherein the first wiper apparatus comprises a first wiper head for pressing a wiping cloth on the component for wiping the component,
the first wiper head comprises a first path,
the first path is for guiding a cleaning solution to the wiping cloth, and
the second wiper apparatus is for wiping the cleaning solution on the component.
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