US 12,121,996 B2
Micro-oscillator, method of manufacturing micro-oscillator, and apparatus for processing micro-oscillator
Yuuki Inagaki, Nisshin (JP); Yuji Ito, Kariya (JP); and Yuki Ichihashi, Kariya (JP)
Assigned to DENSO CORPORATION, Kariya (JP); TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP); and MIRISE Technologies Corporation, Nisshin (JP)
Filed by DENSO CORPORATION, Kariya (JP); TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP); and MIRISE Technologies Corporation, Nisshin (JP)
Filed on Mar. 14, 2023, as Appl. No. 18/183,307.
Claims priority of application No. 2022-041287 (JP), filed on Mar. 16, 2022.
Prior Publication US 2023/0294210 A1, Sep. 21, 2023
Int. Cl. B23K 26/38 (2014.01); B23K 26/08 (2014.01); B23K 37/04 (2006.01); G01C 19/5691 (2012.01); H03B 5/02 (2006.01)
CPC B23K 26/38 (2013.01) [B23K 26/0823 (2013.01); B23K 26/0869 (2013.01); B23K 37/0443 (2013.01); G01C 19/5691 (2013.01); H03B 5/02 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method of manufacturing a micro-oscillator, comprising
preparing a substrate having a flat portion and a curved surface portion formed in a three-dimensional curved shape protruding from one surface of the flat portion, the curved surface portion being surrounded by the flat portion, and
irradiating an outer surface of the curved surface portion with a laser beam to separate the curved surface portion from the flat portion, wherein:
the curved surface portion has a central axis passing through a center point of the curved surface portion, when viewed in a normal direction to the one surface, along the normal direction,
the irradiating includes:
holding the substrate by adsorbing the flat portion of the substrate,
rotating the substrate about the central axis as a rotational axis, and
irradiating the laser beam while the substrate is rotating,
the flat portion of the substrate is held by vacuum suction in the holding, and
the rotating of the substrate includes:
pressing the outer surface of the substrate in a rotating state by a push jig,
adsorbing and moving the substrate toward a rotational axis of a rotating mechanism for rotating the substrate, and
aligning the central axis of the substrate with the rotational axis of the rotating mechanism.