US D1,002,585 S
Earphone
Yosuke Takubo, Kanagawa (JP); Hiroaki Kokubun, Tokyo (JP); and Yutaro Kumagai, Kanagawa (JP)
Assigned to Audio-Technica Corporation, Tokyo (JP)
Filed by Audio-Technica Corporation, Tokyo (JP)
Filed on Nov. 23, 2021, as Appl. No. 29/793,204.
Claims priority of application No. 2021-010944 (JP), filed on May 25, 2021.
Term of patent 15 Years
LOC (14) Cl. 14 - 01
U.S. Cl. D14—223
OG exemplary drawing
 
The ornamental design for an earphone, as shown and described.