US 11,800,687 B2
Heat transfer assembly
SvitLana Trygubova, Lakewood, CO (US); and Steven Allen Nedved, Littleton, CO (US)
Assigned to DISH Network L.L.C., Englewood, CO (US)
Filed by DISH Network L.L.C., Englewood, CO (US)
Filed on Aug. 26, 2021, as Appl. No. 17/446,031.
Prior Publication US 2023/0066818 A1, Mar. 2, 2023
Int. Cl. H05K 7/20 (2006.01); H05K 9/00 (2006.01)
CPC H05K 7/20481 (2013.01) [H05K 7/2049 (2013.01); H05K 7/20509 (2013.01); H05K 9/0024 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A heat transfer assembly comprising:
a heat plate;
a first thermal conductive sheet directly thermally coupled to and extending over at least a portion of the heat plate; and
a first thermal pad directly thermally coupled to the first thermal conductive sheet;
wherein, during operation of a device having a first heat source generating a first heat (“J1”),
the first thermal pad is directly thermally coupled to the first heat source;
the first thermal pad directly transfers the first heat J1 from the first heat source to the first thermal pad;
the first thermal conductive sheet directly transfers the first heat J1 from the thermal pad to the first thermal conductive sheet; and
the heat plate directly transfers the first heat J1 from the thermal conductive sheet to the heat plate.