CPC H05K 7/20481 (2013.01) [H05K 7/2049 (2013.01); H05K 7/20509 (2013.01); H05K 9/0024 (2013.01)] | 20 Claims |
1. A heat transfer assembly comprising:
a heat plate;
a first thermal conductive sheet directly thermally coupled to and extending over at least a portion of the heat plate; and
a first thermal pad directly thermally coupled to the first thermal conductive sheet;
wherein, during operation of a device having a first heat source generating a first heat (“J1”),
the first thermal pad is directly thermally coupled to the first heat source;
the first thermal pad directly transfers the first heat J1 from the first heat source to the first thermal pad;
the first thermal conductive sheet directly transfers the first heat J1 from the thermal pad to the first thermal conductive sheet; and
the heat plate directly transfers the first heat J1 from the thermal conductive sheet to the heat plate.
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