US 11,800,656 B2
Electronic device housing
Mitsushige Hamaguchi, Iyo-gun (JP); Takashi Fujioka, Iyo-gun (JP); and Masato Honma, Iyo-gun (JP)
Assigned to TORAY INDUSTRIES, INC., Tokyo (JP)
Appl. No. 16/325,342
Filed by TORAY INDUSTRIES, INC., Tokyo (JP)
PCT Filed Sep. 25, 2017, PCT No. PCT/JP2017/034456
§ 371(c)(1), (2) Date Feb. 13, 2019,
PCT Pub. No. WO2018/056434, PCT Pub. Date Mar. 29, 2018.
Claims priority of application No. 2016-186529 (JP), filed on Sep. 26, 2016; and application No. 2016-186530 (JP), filed on Sep. 26, 2016.
Prior Publication US 2019/0208654 A1, Jul. 4, 2019
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 5/02 (2006.01); B32B 5/28 (2006.01); B29B 7/90 (2006.01); B29B 9/06 (2006.01); B29B 9/14 (2006.01); B29C 45/14 (2006.01); B32B 5/02 (2006.01); B32B 27/12 (2006.01); B32B 27/20 (2006.01); B29K 63/00 (2006.01); B29L 31/34 (2006.01)
CPC H05K 5/0217 (2013.01) [B29B 7/90 (2013.01); B29B 9/06 (2013.01); B29B 9/14 (2013.01); B29C 45/14336 (2013.01); B32B 5/022 (2013.01); B32B 5/28 (2013.01); B32B 27/12 (2013.01); B32B 27/20 (2013.01); B29K 2063/00 (2013.01); B29K 2713/00 (2013.01); B29L 2031/34 (2013.01); B32B 2457/00 (2013.01)] 4 Claims
OG exemplary drawing
 
1. An electronic device housing comprising a fiber reinforcing member (a) and a fiber reinforcing member (b), wherein
the fiber reinforcing member (a) contains a resin (a1) and discontinuous fibers (a2) that are electrically conductive,
the fiber reinforcing member (b) contains a resin (b1) and continuous fibers (b2) that are not electrically conductive, but does not contain any electrically conductive fibers,
the fiber reinforcing member (a) and the fiber reinforcing member (b) are joined directly without the existence of another layer at a joining face between the fiber reinforcing member (a) and the fiber reinforcing member (b), and
the fiber reinforcing members (a) and (b) satisfy equation (1) and/or equation (2):
0.5<A1/B1<3  equation (1)
A1 being a linear expansion coefficient of the fiber reinforcing member (a), and
B1 being a linear expansion coefficient of the fiber reinforcing member (b),
0.7<A2/B2<1.2  equation (2)
A2 being a bending elastic modulus of the fiber reinforcing member (a), and
B2 being a bending elastic modulus of the fiber reinforcing member (b), and
wherein the fiber reinforcing member (a) has a projected area that accounts for 80% or more and 95% or less of a total projected area and the fiber reinforcing member (b) has a projected area that accounts for at least a part of the remainder of the total projected area so as to allow for radio wave transmissivity, wherein the total projected area accounts for 100% of the electronic device housing projected onto a plane of a top face of the electronic device housing such that the electronic device housing will exhibit radio wave transmissivity.