US 11,800,635 B2
Integrated passive component
Jyou Kikura, Nagaokakyo (JP); Toshihiro Tada, Nagaokakyo (JP); and Tadashi Washimori, Nagaokakyo (JP)
Assigned to Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed on Apr. 16, 2021, as Appl. No. 17/233,200.
Claims priority of application No. 2020-074811 (JP), filed on Apr. 20, 2020.
Prior Publication US 2021/0329773 A1, Oct. 21, 2021
Int. Cl. H01F 27/28 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01); H01G 4/33 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/16 (2006.01)
CPC H05K 1/0216 (2013.01) [H01F 27/2804 (2013.01); H01G 4/008 (2013.01); H01G 4/12 (2013.01); H01G 4/33 (2013.01); H05K 1/0306 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/068 (2013.01); H05K 2201/0792 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An integrated passive component comprising:
a substrate that is insulative;
a capacitor disposed on the substrate, the capacitor including
a dielectric film that mainly contains a same constituent element as a constituent element mainly contained in the substrate, and
at least two electrodes that face each other with the dielectric film interposed therebetween; and
an inductor disposed on the substrate, the inductor including a conductor pattern having at least one end connected to the capacitor,
wherein the substrate and the dielectric film mainly contain silicon and nitrogen as constituent elements.