US 11,799,384 B2
Power converter with co-packaged secondary field effect transistors (FETs)
Todd Edward Takken, Brewster, NY (US); Xin Zhang, Chappaqua, NY (US); and Andrew Ferencz, Southborough, MA (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Jan. 28, 2020, as Appl. No. 16/774,960.
Prior Publication US 2021/0234465 A1, Jul. 29, 2021
Int. Cl. H02M 3/335 (2006.01); H01L 25/07 (2006.01); H02M 3/00 (2006.01)
CPC H02M 3/33576 (2013.01) [H01L 25/074 (2013.01); H02M 3/003 (2021.05)] 20 Claims
OG exemplary drawing
 
1. A structure comprising:
a transformer mounted on a circuit board;
an inductor mounted on the circuit board; and
a circuit including a first field-effect transistor (FET) that is implemented as a forward bias device in a secondary circuit of a forward converter and a second FET that is implemented as a freewheel device in the secondary circuit of the forward converter, wherein:
the first FET and the second FET are co-packaged to form an electronic package;
the first FET and the second FET are arranged in a stacked configuration on a substrate inside the electronic package, wherein the substrate is different from the circuit board mounted with the transformer and the inductor;
the circuit including the co-package first FET and second FET is mounted on the circuit board such that the first FET is coupled between the transformer and the inductor that are mounted on the circuit board; and
the circuit is mounted on the circuit board such that the second FET is coupled between the first FET and ground.