US 11,799,374 B2
Vertical power delivery packaging structure
Xin Zhang, Chappaqua, NY (US); Todd Edward Takken, Brewster, NY (US); and Yuan Yao, Tarrytown, NY (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Sep. 16, 2021, as Appl. No. 17/476,586.
Prior Publication US 2023/0078561 A1, Mar. 16, 2023
Int. Cl. H05K 1/18 (2006.01); H02M 3/00 (2006.01); H05K 3/30 (2006.01)
CPC H02M 3/003 (2021.05) [H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/10719 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A package structure, comprising:
an interconnect component located between a package substrate and a motherboard, wherein a top surface of the interconnect component is connected to a bottom surface of the package substrate, and a bottom surface of the interconnect component is connected to a top surface of the motherboard;
a DC-DC power converter attached to the bottom surface of the package substrate, wherein a plurality of output terminals of the DC-DC power converter are electromechanically connected to the bottom surface of the package substrate via a plurality of solder balls forming a ball grid array (BGA), and wherein the DC-DC power converter is located at least within an open area of the interconnect component located between the package substrate and the motherboard; and
an electrical input cable that provides input power and current to the DC-DC power converter, wherein the electrical input cable is routed laterally through the interconnect component located between the package substrate and the motherboard.