US 11,799,200 B2
Radio assembly with modularized radios and interconnects
Brian Lehman, Ottawa (CA); Thomas Burn, Ottawa (CA); Scott Mason, Ottawa (CA); David Pell, Carp (CA); Jianjun An, Beijing (CN); and Mårten Skoger, Huddinge (SE)
Assigned to TELEFONAKTIEBOLAGET LM ERICSSON (PUBL), Stockholm (SE)
Filed by Telefonaktiebolaget LM Ericsson (publ), Stockholm (SE)
Filed on Jun. 3, 2021, as Appl. No. 17/337,638.
Application 17/337,638 is a continuation of application No. 15/853,644, filed on Dec. 22, 2017, granted, now 11,056,778.
Claims priority of provisional application 62/490,462, filed on Apr. 26, 2017.
Prior Publication US 2021/0288400 A1, Sep. 16, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 1/42 (2006.01); H04W 76/40 (2018.01); H01Q 1/24 (2006.01); H01Q 5/30 (2015.01); H01Q 21/00 (2006.01); H01Q 21/26 (2006.01); H01Q 25/00 (2006.01); H01Q 1/02 (2006.01); H01Q 9/16 (2006.01)
CPC H01Q 1/42 (2013.01) [H01Q 1/246 (2013.01); H01Q 1/247 (2013.01); H01Q 5/30 (2015.01); H01Q 21/0025 (2013.01); H01Q 21/26 (2013.01); H01Q 25/001 (2013.01); H04W 76/40 (2018.02); H01Q 1/02 (2013.01); H01Q 9/16 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A radio assembly, comprising:
at least one radio module and a radome;
the radio module having a heatsink disposed on one side, a radio module base on the other side thereof, the radio module base being disposed between the heatsink and the radome, the heatsink defining a cable channel for routing at least one power cable and at least one data cable;
a faceplate interface board (FIB), the FIB including a plurality of opto-electronic connectors and a power unit;
the at least one power cable being in communication with the power unit, the at least one power cable being routed to the radios via at least one cable aperture; and
the at least one data cable being in communication with at least one opto-electronic connector of the plurality of opto-electronic connectors, the at least one data cable being routed to the radios via the at least one cable aperture.