US 11,799,199 B2
Electronic device housing and method for producing same
Mitsushige Hamaguchi, Iyo-gun (JP); Takashi Fujioka, Iyo-gun (JP); and Masato Honma, Iyo-gun (JP)
Assigned to TORAY INDUSTRIES, INC., Tokyo (JP)
Appl. No. 16/325,341
Filed by TORAY INDUSTRIES, INC., Tokyo (JP)
PCT Filed Sep. 25, 2017, PCT No. PCT/JP2017/034455
§ 371(c)(1), (2) Date Feb. 13, 2019,
PCT Pub. No. WO2018/056433, PCT Pub. Date Mar. 29, 2018.
Claims priority of application No. 2016-186527 (JP), filed on Sep. 26, 2016; and application No. 2016-186528 (JP), filed on Sep. 26, 2016.
Prior Publication US 2019/0237862 A1, Aug. 1, 2019
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 1/40 (2006.01); H05K 5/02 (2006.01); G06F 1/16 (2006.01); H01Q 1/22 (2006.01)
CPC H01Q 1/40 (2013.01) [G06F 1/1633 (2013.01); H05K 5/0217 (2013.01); H05K 5/0247 (2013.01); H01Q 1/22 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An electronic device housing comprising a fiber reinforcing member (a) and a fiber reinforcing member (b), wherein
the fiber reinforcing member (a) contains a thermoplastic resin (a1) and discontinuous fibers (a2),
the fiber reinforcing member (b) contains a thermosetting resin (b1) and continuous fibers (b2) that are not electrically conductive, and does not contain any fibers that are electrically conductive,
a projected area of the fiber reinforcing member (a) accounts for 80% or more and 95% or less of the total projected area, which accounts for 100%, of the electronic device housing projected onto a plane, and
the thermoplastic resin (a1) has a property (i) and/or (ii) given below:
(i) a melting point of more than 265° C., and
(ii) a water absorption rate of 0.4% or less.