CPC H01Q 1/2283 (2013.01) [H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01P 3/08 (2013.01); H01Q 1/48 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6683 (2013.01)] | 20 Claims |
1. An integrated circuit package comprising:
at least one dielectric layer;
an integrated circuit die disposed on a first side of the at least one dielectric layer; and
a plurality of conductor layers interspersed with the at least one dielectric layer,
wherein the plurality of conductor layers includes a first conductor layer disposed on a second side of the at least one dielectric layer opposite the first side,
wherein the first conductor layer includes a plurality of transmitter antennas electrically coupled to the integrated circuit die and aligned in a first direction, at least one of the plurality of transmitter antennas configured to emit an electromagnetic wave at a set frequency,
wherein the first conductor layer includes a plurality of receiver antennas electrically coupled to the integrated circuit die and aligned in a second direction that is approximately perpendicular to the first direction, and
wherein antennas of at least one of the plurality of transmitter antennas and the plurality of receiver antennas are spaced at a pitch that is less than or equal to about half of the wavelength of the electromagnetic wave.
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