US 11,799,046 B2
Solid-state imaging element and imaging device with avalanche photodiode
Yuhi Yorikado, Kanagawa (JP); Atsushi Toda, Kanagawa (JP); and Susumu Inoue, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed on May 15, 2020, as Appl. No. 16/875,261.
Application 16/875,261 is a continuation of application No. 16/293,384, filed on Mar. 5, 2019, granted, now 10,714,521.
Application 16/293,384 is a continuation of application No. 15/746,054, granted, now 10,283,544, issued on May 7, 2019, previously published as PCT/JP2016/080501, filed on Oct. 14, 2016.
Claims priority of application No. 2015-236329 (JP), filed on Dec. 3, 2015.
Prior Publication US 2020/0279884 A1, Sep. 3, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 31/107 (2006.01); G02B 3/00 (2006.01); H01L 27/14 (2006.01); H01L 27/146 (2006.01); H01L 31/0224 (2006.01); H01L 31/0232 (2014.01); H04N 25/62 (2023.01); H04N 25/76 (2023.01); H04N 25/70 (2023.01); H04N 25/13 (2023.01)
CPC H01L 31/107 (2013.01) [G02B 3/00 (2013.01); H01L 27/14 (2013.01); H01L 27/146 (2013.01); H01L 27/14603 (2013.01); H01L 27/14627 (2013.01); H01L 27/14629 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 31/02327 (2013.01); H01L 31/022408 (2013.01); H04N 25/134 (2023.01); H04N 25/62 (2023.01); H04N 25/70 (2023.01); H04N 25/76 (2023.01); G02B 3/0056 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A solid-state imaging element, comprising:
a photodiode that includes a light receiving surface and an electrode placed on the light receiving surface, and that outputs an electrical signal in accordance with light incident on the light receiving surface in a state where a voltage exceeding a breakdown voltage is applied to the electrode;
a signal line, wherein the signal line is a wiring that extends across a portion of the light receiving surface of the photodiode and is electrically connected to the electrode; and
a light collecting section that causes light from a subject to be collected in the light receiving surface other than a region where the electrode is placed,
wherein the light collecting section includes a microlens,
wherein the microlens has a cut in a bottom portion of the microlens, and
wherein the cut is placed along the signal line.