US 11,798,967 B2
Image sensor package with transparent adhesive covering the optical sensing circuit
How Yang Lim, Simei (SG); and Olivier Zanellato, Chambery (FR)
Assigned to STMicroelectronics Asia Pacific Pte Ltd, Singapore (SG); and STMicroelectronics (Grenoble 2) SAS, Grenoble (FR)
Filed by STMicroelectronics Asia Pacific Pte Ltd, Singapore (SG); and STMicroelectronics (Grenoble 2) SAS, Grenoble (FR)
Filed on Oct. 6, 2021, as Appl. No. 17/495,047.
Prior Publication US 2023/0104584 A1, Apr. 6, 2023
Int. Cl. H01L 27/146 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H04N 23/55 (2023.01)
CPC H01L 27/14627 (2013.01) [H01L 23/31 (2013.01); H01L 24/14 (2013.01); H04N 23/55 (2023.01)] 11 Claims
OG exemplary drawing
 
1. An integrated circuit package, comprising:
a support substrate having a front side and a back side;
an optical integrated circuit die having a back side mounted to the front side of the support substrate and having a front side with an optical sensing circuit;
a glass optical element die having a back side mounted to the front side of the optical integrated circuit die over the optical sensing circuit;
a film layer of transparent adhesive positioned between the glass optical element and the optical integrated circuit die, wherein said film layer extends to cover the optical sensing circuit and a portion of the front side of the optical integrated circuit die peripherally surrounding the optical sensing circuit; and
an encapsulation material body which encapsulates the glass optical element die and the optical integrated circuit die.