US 11,798,931 B2
Semiconductor package
Jie Chen, New Taipei (TW); Hsien-Wei Chen, Hsinchu (TW); and Ming-Fa Chen, Taichung (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Aug. 30, 2021, as Appl. No. 17/460,320.
Prior Publication US 2023/0062320 A1, Mar. 2, 2023
Int. Cl. H01L 25/18 (2023.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01)
CPC H01L 25/18 (2013.01) [H01L 23/3107 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/32145 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a first die comprising a first substrate and an optical coupler formed on the first substrate;
a second die disposed on the first die and comprising a second substrate and a transparent portion, the transparent portion overlapping the optical coupler; and
a transparent encapsulation material disposed on the first die and laterally encapsulating the second die, the transparent encapsulation material comprising an interface with the second substrate, wherein the transparent portion is spaced apart from the transparent encapsulation material by the second substrate.