US 11,798,924 B2
Batch soldering of different elements in power module
Kirill Trunov, Warstein (DE); Waltraud Eisenbeil, Grossostheim (DE); Frederick Groepper, Paderborn (DE); Joerg Schadewald, Warstein (DE); Arthur Unrau, Geseke (DE); and Ulrich Wilke, Soest (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Jun. 16, 2020, as Appl. No. 16/902,725.
Prior Publication US 2021/0391310 A1, Dec. 16, 2021
Int. Cl. H01L 25/16 (2023.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01)
CPC H01L 25/16 (2013.01) [H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32507 (2013.01); H01L 2224/8381 (2013.01); H01L 2224/83815 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method of batch soldering, comprising:
providing a first passive device that comprises a metal joining surface;
arranging the first passive device on a first metal region of a substrate with a region of first solder material between the metal joining surface of the first passive device and the substrate;
providing a semiconductor die that comprises a metal joining surface;
arranging the semiconductor die on a second metal region of the substrate with a region of second solder material between the metal joining surface of the semiconductor die and the substrate; and
performing a common soldering step that simultaneously forms a first soldered joint from the region of first solder material and forms a second soldered joint from the region of second solder material,
wherein the common soldering step is performed at a soldering temperature such that the region of second solder material melts and reacts with the metal joining surface of the semiconductor die and the second metal region of the substrate to form one or more intermetallic phases within the second soldered joint, each of the one or more intermetallic phases having a melting point above the second solder material and the soldering temperature, and
wherein the common soldering step forms the first soldered joint by reflow of the first solder material and forms the second soldered joint by diffusion soldering.