US 11,798,859 B2
Electronic device package and method of manufacturing the same
Chia-Pin Chen, Kaohsiung (TW); Chia-Sheng Tien, Kaohsiung (TW); Wan-Ting Chiu, Kaohsiung (TW); and Chi Long Tsai, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on May 11, 2021, as Appl. No. 17/317,762.
Prior Publication US 2022/0367306 A1, Nov. 17, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/18 (2023.01); H01L 25/065 (2023.01)
CPC H01L 23/3135 (2013.01) [H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/24175 (2013.01); H01L 2224/24265 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electronic device package, comprising:
an encapsulated electronic component, comprising:
a redistribution layer (RDL); and
an encapsulation layer including a first surface and a second surface opposite to the first surface, wherein the first surface is closer to the RDL than the second surface is;
a substrate disposed on the second surface of the encapsulation layer;
a conductor disposed between the substrate and the encapsulated electronic component, and electrically connecting the substrate to the encapsulated electronic component; and
a buffer layer disposed between the substrate and the encapsulated electronic component and around the conductor,
wherein the buffer layer includes a first opening for the conductor electrically connecting the encapsulated electronic component, and the first opening has a first aperture having a first width, and a second aperture having a second width, the first aperture is closer to the substrate than the second aperture is, and the second width is larger than the first width.