CPC H01L 23/31 (2013.01) [C08G 73/22 (2013.01); C08K 5/1345 (2013.01); C08L 33/24 (2013.01); C08L 79/08 (2013.01); H01L 21/76802 (2013.01); H01L 23/16 (2013.01)] | 20 Claims |
1. A package, comprising:
a die comprising a sensing component;
through insulating vias (TIV) surrounding the die;
an encapsulant laterally encapsulating the die and the TIVs; and
a redistribution structure over the die, the TIVs, and the encapsulant, wherein the redistribution structure has an opening exposing the sensing component of the die, and a top surface of the redistribution structure is slanted downward continuously from an edge of the package toward a center of the package.
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