US 11,798,857 B2
Composition for sacrificial film, package, manufacturing method of package
Yung-Chi Chu, Kaohsiung (TW); Hung-Jui Kuo, Hsinchu (TW); Yu-Hsiang Hu, Hsinchu (TW); and Sih-Hao Liao, New Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jun. 10, 2020, as Appl. No. 16/897,287.
Claims priority of provisional application 62/906,748, filed on Sep. 27, 2019.
Prior Publication US 2021/0098321 A1, Apr. 1, 2021
Int. Cl. H01L 23/31 (2006.01); H01L 23/16 (2006.01); C08L 79/08 (2006.01); H01L 21/768 (2006.01); C08G 73/22 (2006.01); C08K 5/134 (2006.01); C08L 33/24 (2006.01)
CPC H01L 23/31 (2013.01) [C08G 73/22 (2013.01); C08K 5/1345 (2013.01); C08L 33/24 (2013.01); C08L 79/08 (2013.01); H01L 21/76802 (2013.01); H01L 23/16 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package, comprising:
a die comprising a sensing component;
through insulating vias (TIV) surrounding the die;
an encapsulant laterally encapsulating the die and the TIVs; and
a redistribution structure over the die, the TIVs, and the encapsulant, wherein the redistribution structure has an opening exposing the sensing component of the die, and a top surface of the redistribution structure is slanted downward continuously from an edge of the package toward a center of the package.